Electronic component package and method of manufacturing the same

ABSTRACT

An electronic component package includes a wiring part including an insulating layer, a conductive pattern formed on the insulating layer, and a conductive via connected to the conductive pattern through the insulating layer, an electronic component disposed on the wiring part, a frame disposed on the wiring part and having a through hole accommodating the electronic component, an adhesive layer bonding the wiring part and the frame to each other, and an encapsulant filling at least a portion of the through hole.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims benefit of priority to Korean Patent ApplicationNo. 10-2015-0183172, filed on Dec. 21, 2015 with the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference.

TECHNICAL FIELD

The present disclosure relates to an electronic component package andmanufacturing method thereof.

BACKGROUND

An electronic component package refers to package technology forelectrically connecting an electronic component to a printed circuitboard (PCB), such as a main board of an electronic device, andprotecting the electronic component from external impacts. Recently, onemajor trend of technical development regarding electronic components isreducing a size of components, and in line with this, in a packagefield, electronic components having a reduced size while retaining aplurality of pins are required to meet the rapid demand for miniaturizedelectronic components.

A wafer level package (WLP) using a redistribution line (RDL) of anelectrode pad of an electronic component formed on a wafer has beenproposed as a package technique to meet the aforementioned technicalrequirements. The WLP includes a fan-in WLP and a fan-out WLP, and inparticular, the fan-out WLP, advantageous for realizing a plurality ofpins with a reduced size, has been actively developed in recent years.

Meanwhile, when such a package is manufactured, an electrical test isrequired to determine whether the package is defective or not.Conventionally, the electrical test is generally performed after anelectronic component such as an integrated circuit (IC) chip is mountedin the package. However, in a case in which an electrical test isperformed with the electronic component mounted in the package and thepackage is determined to be defective, even the electronic component, inaddition to a wiring layer forming the package, may have to bediscarded, creating significant loss for manufacturers.

SUMMARY

An aspect of the present disclosure may provide an electronic componentpackage having a compact structure and allowing for electricalinspection of a wiring part of the electronic component package beforean electronic component is mounted to the wiring part to thussignificantly enhance manufacturing efficiency.

An aspect of the present disclosure may also provide a method ofeffectively manufacturing the aforementioned electronic componentpackage.

According to an aspect of the present disclosure, an electroniccomponent package may include: a wiring part including an insulatinglayer, a conductive pattern formed on the insulating layer, and aconductive via connected to the conductive pattern through theinsulating layer; an electronic component disposed on the wiring part; aframe disposed on the wiring part and having a through holeaccommodating the electronic component; an adhesive layer bonding thewiring part and the frame to each other; and an encapsulant filling atleast a portion of the through hole.

According to another aspect of the present disclosure, a method ofmanufacturing an electronic component package may include: preparing awiring part including an insulating layer, a conductive pattern formedon the insulating layer, and a conductive via connected to theconductive pattern through the insulating layer; disposing an electroniccomponent on the wiring part; preparing a frame having a through holeand bonding the frame to an upper surface of the wiring part by anadhesive layer; and forming an encapsulant to fill at least a portion ofthe through hole.

According to another aspect of the present disclosure, an electroniccomponent package may include: a wiring part including an insulatinglayer, a conductive pattern formed on the insulating layer, and aconductive via connected to the conductive pattern through theinsulating layer; an electronic component disposed on the wiring partand having an electrode pad electrically connected to the conductivepattern through a conductive structure disposed therebetween; a framedisposed on the wiring part and having a through hole accommodating theelectronic component; an adhesive layer bonding the wiring part and theframe to each other; and an encapsulant filling at least a portion ofthe through hole. A melting temperature of the conductive structure islower than that of the conductive pattern of the wiring part and theelectrode pad of the electronic component.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a block diagram schematically illustrating an example of anelectronic device system;

FIG. 2 is a view schematically illustrating an example of an electroniccomponent package applied to an electronic device;

FIG. 3 is a cross-sectional view schematically illustrating an exampleof an electronic component package;

FIGS. 4 through 8 are cross-sectional views schematically illustrating amethod of manufacturing an electronic component package according to anexemplary embodiment in the present disclosure; and

FIGS. 9 through 13 are cross-sectional views schematically illustratinga method of manufacturing an electronic component package according toanother exemplary embodiment in the present disclosure.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present inventive concept will bedescribed as follows with reference to the attached drawings.

The present inventive concept may, however, be exemplified in manydifferent forms and should not be construed as being limited to thespecific embodiments set forth herein. Rather, these embodiments areprovided so that this disclosure will be thorough and complete, and willfully convey the scope of the disclosure to those skilled in the art.

Throughout the specification, it will be understood that when anelement, such as a layer, region or wafer (substrate), is referred to asbeing “on,” “connected to,” or “coupled to” another element, it can bedirectly “on,” “connected to,” or “coupled to” the other element orother elements intervening therebetween may be present. In contrast,when an element is referred to as being “directly on,” “directlyconnected to,” or “directly coupled to” another element, there may be noelements or layers intervening therebetween. Like numerals refer to likeelements throughout. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

It will be apparent that though the terms first, second, third, etc. maybe used herein to describe various members, components, regions, layersand/or sections, these members, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one member, component, region, layer or section fromanother region, layer or section. Thus, a first member, component,region, layer or section discussed below could be termed a secondmember, component, region, layer or section without departing from theteachings of the exemplary embodiments.

Spatially relative terms, such as “above,” “upper,” “below,” and “lower”and the like, may be used herein for ease of description to describe oneelement's relationship to another element(s) as shown in the figures. Itwill be understood that the spatially relative terms are intended toencompass different orientations of the device in use or operation inaddition to the orientation depicted in the figures. For example, if thedevice in the figures is turned over, elements described as “above,” or“upper” other elements would then be oriented “below,” or “lower.”

Electronic Device

FIG. 1 is a block diagram schematically illustrating an example of anelectronic device system. Referring to FIG. 1, an electronic device 1000includes a main board (or mother board) 1010. A chip-related component1020, a network-related component 1030, and other components 1040 arephysically and/or electrically connected to the main board 1010. Thesecomponents are also coupled to other components as described hereinafterto form various signal lines 1090.

The chip-related component 1020 includes a memory chip such as avolatile memory (for example, a DRAM), a non-volatile memory (forexample, a ROM), or a flash memory, an application processor chip suchas a central processor (for example, a CPU), a graphics processor (forexample, a GPU), a digital signal processor, a cryptography processor, amicroprocessor, or a microcontroller, and a logic chip such as ananalog-to-digital converter (ADC), or an application-specific integratedcircuit (ASIC). However the chip-related component 1020 is not limitedthereto, and may include any other types of chip-related component.Also, these components 1020 may be combined with each other.

The network-related component 1030 may include Wi-Fi (IEEE 802.11family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (longterm evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPS, GPRS,CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and certain otherwireless/wired protocols designated thereafter. However, thenetwork-related component 1030 is not limited thereto, and may includeany other wireless or wired standards or protocols. Also, thesecomponents 1030 may be combined together with the aforementionedchip-related component 1020.

The other components 1040 may include a high frequency (HF) inductor, aferrite inductor, a power inductor, ferrite beads, low-temperatureco-firing ceramics (LTCC), an electro-magnetic interference (EMI)filter, a multilayer ceramic condenser (MLCC), and the like. However,the other components 1040 are not limited thereto, and may includepassive components, or the like, used for various other purposes. Also,these components 1040 may be combined together with the aforementionedchip-related component 1020 and/or the network-related component 1030.

The electronic device 1000 may include any other components that may ormay not be physically and/or electrically connected to the main board1010 according to types of the electronic device 1000. These componentsinclude a camera 1050, an antenna 1060, a display 1070, a battery 1080,an audio codec (not shown), a video codec (not shown), a power amplifier(not shown), a compass (not shown), an accelerometer (not shown), agyroscope (not shown), a speaker (not shown), a mass storage device (forexample, a hard disk drive) (not shown), a compact disc (not shown), anda digital versatile disc (not shown). However, the any other componentsare not limited thereto, and may include other components used forvarious purposes according to types of the electronic device 1000.

The electronic device 1000 may be a smartphone, a personal digitalassistant (PDA), a digital video camera, a digital still camera, anetwork system, a computer, a monitor, a tablet, a laptop computer, anetbook, a television, a video game console, or a smart watch. However,the electronic device 1000 is not limited thereto, and may be any othercertain electronic device processing data.

FIG. 2 is a view schematically illustrating an example of an electroniccomponent package applied to an electronic device. The electroniccomponent package is applied to various electronic devices 1000 forvarious purposes as described above. For example, a main board 1110 isaccommodated within a body 1101 of a smartphone 1100, and variouselectronic components 1120 are physically and/or electrically connectedto the main board 1110. Also, another component that may be physicallyand/or electrically connected to the main board 1110, or not, such as acamera 1130, may be accommodated within the body 1101. Here, some of theelectronic components 1120 may be chip-related components as describedabove, and an electronic component package 100 may be an applicationprocessor, for example, but is not limited thereto.

Electronic Component Package and Method of Manufacturing the Same

FIG. 3 is a cross-sectional view schematically illustrating an exampleof an electronic component package. An electronic component package 100according to an exemplary embodiment may include a wiring part 110, anelectronic component 120, a frame 130, an adhesive layer 131, and anencapsulant 140 as major components.

The wiring part 110 may be provided as a mounting region of theelectronic component 120 and electrically connected to the electroniccomponent 120. The wiring part 110 may include an insulating layer 111,a conductive pattern 112, and a conductive via 113, and may serve tore-distribute a wiring structure of the electronic component 120. In theexample of FIG. 3, the wiring part 110 illustrated has a multilayerstructure, but the wiring part 110 may be formed as a monolayer asnecessary. Also, the wiring part 110 may have a larger amount of layersaccording to design particulars.

As an insulating material that may be included in the insulating layer111, a thermosetting resin such as an epoxy resin, a thermoplastic resinsuch as polyimide, a resin obtained by impregnating the thermosettingresin or the thermoplastic resin with a stiffener such as glass fiber oran inorganic filler, such as pre-preg, Ajinomoto build-up film (ABF),FR-4, bismaleimide triazine (BT) resin, and the like, may be used. Also,in a case in which a photocurable material (PID) is used as aninsulating material, the insulating layer 111 may be formed to bethinner and a micro-pattern may be more easily realized. The insulatinglayers 111 forming respective layers of the wiring part 110 may beformed of the same material, and may be formed of different materials asnecessary. A thickness of the insulating layer 111 is not particularlylimited. For example, a thickness of each layer, excluding a conductivepattern 112, may range from about 5 μm to 20 μm, and may range fromabout 15 μm to 70 μm with the conductive pattern 112 included.

The conductive pattern 112 may serve as a wiring pattern and/or a padpattern, and may be formed of an electrically conductive material suchas copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel(Ni), lead (Pd), or alloys thereof. The conductive pattern 112 mayperform various functions according to a design of a correspondinglayer. For example, the conductive pattern 112 may serve as a ground(GND) pattern, a power (PWR) pattern, a signal (S) pattern, or as aredistribution pattern. Here, the signal (S) pattern includes varioussignals, such as a data signal, or the like, excluding the ground (GND)pattern and the power (PWR) pattern. Also, the conductive pattern 112may serve as a via pad or an external connection terminal pad, as a padpattern. A thickness of the conductive pattern 112 is not particularlylimited, and may range from 10 μm to 50 μm, for example.

A surface-treated layer may be formed on the conductive pattern 112positioned to be exposed to the outside of the insulating layer 111, forexample, the conductive pattern connected to the electronic component120 as necessary. The surface-treated layer is not particularly limitedas long as it is known in the art, and may be formed throughelectrolytic gold plating, electroless gold plating, organicsolderability preservative (OSP) or electroless tin plating, electrolesssilver plating, electroless nickel plating/immersion gold plating,direct immersion gold (DIG) plating, hot air solder leveling (HASL), andthe like.

In the present exemplary embodiment, the conductive pattern 112positioned on the surface of the wiring part 110 opposing the surfacethereof on which the electronic component 120 is disposed, that is,disposed on a lower surface of the wiring part 110 in FIG. 3, mayfunction as a connection pad which becomes a connection path withanother board or device, and, as described hereinafter, the conductivepattern 112 may be embedded in the insulating layer 111 through aprocess using a support.

The conductive via 113 may electrically connect the conductive patterns112, or the like, formed on different layers to each other, and as aresult may form an electrical path within the package 100. As aformation material of the conductive via 113, a conductive material suchas copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel(Ni), lead (Pd), or alloys thereof may also be used. The conductive via113 may be completely filled with a conductive material, or a conductivematerial may be formed on a wall of the via. The conductive via 113 mayhave any shape known in the art, such as a tapered shape in which adiameter thereof is decreased toward a lower surface thereof, a reversetapered shape in which a diameter thereof is increased toward the lowersurface thereof, and a cylindrical shape.

The frame 130, disposed on the wiring part 110 to support the package100 may maintain rigidity and secure thickness uniformity. The frame 130may have a through hole for disposing the electronic component 120, andsuch a through hole may be formed by an inner wall surrounding theelectronic component 120. The electronic component 120 may be positionedwithin the through hole. According to exemplary embodiments, a region inwhich the electronic component 120 is disposed may have a shape of atrench, rather than the shape of the through hole.

A material used to form the frame 130 is not particularly limited, and amolding resin or pre-preg, preferably a metal or a ceramic material, maybe used. For example, as described hereinafter, after a hole is formedin the pre-preg, the frame 130 may be bonded to the wiring part 110, andto this end, an adhesive layer 131 may be interposed between the frame130 and the wiring part 110.

In the present exemplary embodiment, a conductive via 132 penetratingthrough the frame 130 and serving as an electrically conductivestructure of upper and lower portions may be formed in the frame 130.For example, as illustrated in FIG. 3, the conductive via 132 of theframe 130 may be provided in such a manner that the conductive via 132may be connected to the conductive pattern 112 of the wiring part 110and the conductive pattern 133 formed on an upper portion of the frame130. The conductive pattern 133, an element formed on the encapsulant140 and electrically connected to the conductive via 132 of the frame130, may be connected to an additional electronic component that may bedisposed on an upper portion thereof. In this case, the conductive via132 may be formed by forming a hole in the frame 130 and filling thehole through a method such as plating, or the like, or may be formed asa conductive post.

The electronic component 120 may be various active components (such as adiode, a vacuum tube, a transistor, etc.) or passive components (such asan inductor, a condenser, a resistor, etc.). Also, the electroniccomponent 120 may be an integrated circuit (IC) chip as a single chip inwhich hundreds of to millions of or more elements are integrated. Ifnecessary, the electronic component 120 may be an electronic componentin which an IC is packaged as a flipchip. The IC chip may be anapplication processor chip such as a central processor (such as a CPU),a graphics processor (such as a GPU), a digital signal processor, acryptography processor, a microprocessor, or a microcontroller, forexample, but is not limited thereto. Here, in FIG. 3, a configuration inwhich one electronic component 120 is mounted on the wiring part 110 isillustrated, but two or more components may also be used.

The electronic component 120 may include one or more electrode pad 121electrically connected to the wiring part 110, and as illustrated in theexample of FIG. 3, the electronic component 120 may be mounted in astate in which the electrode pads 121 thereof face the wiring part 110.The electronic component 120 may be redistributed by the wiring part110, and to this end, the conductive pattern 112 of the wiring part 110and an adhesive electric connection portion 122 such as a solder, or thelike, may be interposed between the electronic component 120 and thewiring part 110. Also, in order to stably mount the electronic component120, an adhesive portion 123 formed of an insulating adhesive layer, orthe like, may be interposed between the electronic component 120 and thewiring part 110. Here, the adhesive portion 123 may be appropriatelymodified or excluded according to exemplary embodiments. For example,the adhesive portion 123 may be a solder resist formed to expose theelectrode pads 121 of the electronic component 120. A thickness of theelectronic component 120 in a cross-section thereof is not particularlylimited, and may vary according to types of the electronic component120. For example, in a case in which the electronic component 120 is anIC chip, the thickness of the electronic component 120 in thecross-section thereof may range from about 100 μm to 480 μm, but is notlimited thereto.

The encapsulant 140, which serves to protect the electronic component120, covers the electronic component 120 and fills at least a portion ofthe through hole of the frame 130. Also, as illustrated in FIG. 3, theencapsulant 140 may be formed to cover up to an upper portion of theframe 130. In this case, a corresponding portion of the encapsulant 140formed on the upper portion of the frame 130 may expose a regioncorresponding to the conductive via 132 of the frame 130, and throughthis configuration, an additional electronic component, or the like, maybe mounted on the upper portion.

A material used to form the encapsulant 140 is not particularly limitedas long as the encapsulant 140 may perform the function of protectingthe electronic component. For example, the encapsulant 140 may be formedof a thermosetting resin such as an epoxy resin, a thermoplastic resinsuch as polyimide, a resin obtained by impregnating the thermosettingresin or the thermoplastic resin with a stiffener such as glass fiber oran inorganic filler, such as pre-preg, ABF, FR-4, BT, a PID resin, andthe like. Also, the encapsulant 140 may be obtained by stacking anuncured resin film on the wiring part 110 and the frame 130 and curingthe resin film, and in addition to this method, the encapsulant 140 maybe obtained using a known molding scheme such as EMC, or the like.

In order to block electromagnetic waves, the encapsulant 140 may includeconductive particles as necessary. Any conductive particles may beformed of any material as long as the material is able to blockelectromagnetic waves. For example, the conductive particles may beformed of copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au),nickel (Ni), lead (Pd), or solder, but is not limited thereto.

The adhesive layer 131 is disposed between the wiring part 110 and theframe 130 to bond the wiring part 110 and the frame 130, and serves tobond the appropriately processed frame 130 to the wiring part 110 asdescribed hereinafter in relation to a process. For example, theadhesive layer 131 may be formed of an uncured material, such aspre-preg or a solder resist, and may be electrically connected to theconductive pattern, or the like, using an electrically conductivematerial in addition to an electrically insulating material. When theadhesive layer 131 in an uncured state is pressed, the adhesive layer131 may extend up to the through hole of the frame 130 (please refer toa region A). Here, as illustrated in FIG. 3, the adhesive layer 131cured in a state of having been flown up to the through hole of theframe 130 may be in contact with the encapsulant 140 filling the throughhole. That is, a portion of the adhesive layer 131 may be formed betweenan inner surface of the through hole and the electronic component 120.Such a shape of the adhesive layer 131 may be obtained through a bondingprocess of the wiring part 110 and the frame 130, providing structuralstability of the package 100.

An external layer 150 may be formed in a lower portion of the wiringpart 110 and an upper portion of the frame 130 in order to protect thewiring part 120 and the frame 130 from an external physical or chemicalinfluence. In this case, the external layer 150 may have an openingexposing at least a portion of the conductive patterns 112 and 133. Amaterial of the external layer 150 is not particularly limited, and asolder resist may be used, for example. In addition, the same materialas that of the insulating layer 111 of the wiring part 110 may be used.The external layer 150 is generally a monolayer, but may be configuredas a multilayer as necessary.

Although not shown, a connection terminal may be provided in thelowermost portion of the electronic component package 100. Theconnection terminal is a component physically and/or electricallyconnecting the electronic component package 100 to the exterior. Forexample, the electronic component package 100 is mounted on a main boardof an electronic device through the connection terminal. The connectionterminal is connected to the conductive pattern 112 through the openingformed in the external layer 150, and is also electrically connected tothe electronic component 120 through the conductive pattern 112 and theconductive via 113. The connection terminal may be formed of, forexample, a conductive material such as copper (Cu), aluminum (Al),silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pd), or solder, buta material of the connection terminal is not limited thereto. Theconnection terminal may be a land, a ball, or a pin. The connectionterminal may be formed as a multilayer or a monolayer. When theconnection terminal is formed as a multilayer, the connection terminalmay include a copper pillar and a solder, and when the connectionterminal is formed as a monolayer, the connection terminal may include,for example, tin-silver solder or copper, but is not limited thereto.

A portion of the external connection terminal may be disposed in a fanout region. The fan-out region refers to a region outside of a region inwhich an electronic component is disposed. That is, the electroniccomponent package 100 according to an exemplary embodiment is a fan-outpackage. The fan-out package has excellent reliability, realizes aplurality of I/O terminals, and is easy to create a 3D interconnectionin comparison to a fan-in package. Also, in comparison to a ball gridarray (BGA) package or a land grid array (LGA) package, the fan-outpackage is able to be mounted on an electronic device without a separateboard, which leads to a reduction in a thickness thereof and hasexcellent price competitiveness.

Since the aforementioned electronic component package 100 does notinclude aboard such as an interposer, or the like, it may be formed tohave a compact size, and in addition, the electronic component package100 may have a structure appropriate for a partial electrical testbefore an electronic component is mounted therein. Thus, unnecessarywaste of the electronic component 120 which is relatively high in priceamong components of the package may be reduced. That is, when anelectrical test is performed after the electronic components 120 aremounted, even if a wiring part, rather than the electronic component, isdefective, the electronic component 120 becomes useless. Hereinafter, amethod of manufacturing an electronic component package having theaforementioned structure in the present disclosure will be described. Apackage structure according to the aforementioned exemplary embodimentor the modified example may be more clearly understood throughdescriptions of the manufacturing method.

FIGS. 4 through 8 are cross-sectional views schematically illustrating amethod of manufacturing an electronic component package according to anexemplary embodiment in the present disclosure.

First, as illustrated in FIG. 4, a wiring part 110 is formed on asupport 160. The support 160 serves to handle the wiring part 110 whichis relatively thin, and a material used to form the support 160 is notlimited as long as it serves to support the wiring part 110. The support160 may have a multilayer structure, and may include a release layer ora metal layer so that the support 160 may be readily removed withrespect to the wiring part 110 in a follow-up process. In the presentexemplary embodiment, as described hereinafter, an electrical test maybe performed on the wiring part 110 in a state in which the support 160is bonded to the wiring part 110.

In order to realize the wiring part 110, the insulating layer 111, theconductive pattern 112, and the conductive via 113 may be formed to havean intended shape, and the insulating layer 111, the conductive pattern112, and the conductive via 113 may be formed repeatedly for a desirednumber of times. In detail, the insulating layer 111 may be formedthrough a known method. For example, the insulating layer 111 may beformed through a method of laminating and subsequently curing amaterial, or a method of coating and curing a material.

As the lamination method, for example, a method of pressing a materialat high temperatures for a predetermined period of time anddecompressing and cooling the material to room temperature in a hotpress, and subsequently cooling the material in a cold press andseparating a working tool, may be used. As the coating method, a screenprinting method of applying ink with a squeegee, or a spray printingmethod of applying ink in a spray manner may be used. Here, curing maybe drying in such a manner that a material is not completely cured inorder to use a photolithography process as a post-process.

In the present exemplary embodiment, an electrical test may be performedat this stage before the electronic component 120 is mounted. In detail,it is determined whether the wiring part 110 is defective in terms ofelectrical connection. For example, a testing jig may be connected tothe conductive pattern 112 in an upper portion of the wiring part 110.Through the electrical test, whether the wiring part 110 is defectivemay be determined in advance, minimizing an unnecessary waste of anelectronic component. That is, when the wiring part 110 is determined tobe defective in the test, the wiring part 110 may be discarded orrecycled for another purpose, and a follow-up process may not beperformed to reduce process cost. The wiring part 110 may have anadditional structure such as a daisy chain for an electrical test, andthus, even in a state in which the support 160 is bonded to a lowersurface of the wiring part 110, the electrical test may be performed onan upper surface of the wiring part 110.

After the electrical test is performed on the wiring part 110, asillustrated in FIG. 5, the electronic component 120 is mounted on thewiring part 110, and in this case, the electronic component 120 may bedisposed in such a manner that the electrode pad 121 faces the wiringpart 110. In order to stably mount the electronic component 120, anadhesive electrical connection portion 122 such as a solder or the likeand an adhesive portion 123 formed, for example, of an insulatingadhesive layer, a solder resist, or the like may be formed on the wiringpart 110 before the electronic component 120 is mounted.

Thereafter, as illustrated in FIG. 6, a frame 130 having a through holeis prepared and bonded to the wiring part 110, and, to this end, anadhesive layer 131 is interposed between the frame 130 and the wiringpart 110. Before the bonding process, a through hole is formed in theframe 130 at a position corresponding to the electronic component 120through laser beam machining or mechanical machining. In this case, amaterial forming the frame 130 is not particularly limited, and pre-pregin a cured state may be used. Alternatively, any adhesive layer 131 maybe used as long as it provides a stable bonding function. For example,prepreg in an uncured state or a solder resist may be used. Through thisbonding process, the adhesive layer 131 may be cured in a state in whichthe adhesive layer 131 flows up to the through hole as described above.

In the present exemplary embodiment, a scheme in which the frame 130 isbonded after the electronic component 120 is mounted is described, butthe order may be changed. That is, after an electrical test regardingthe wiring part 110, the frame 130 may first be bonded and theelectronic component 120 may then be mounted. In this case, the throughhole may be formed before or after the frame 130 is bonded.

After or when the frame 130 is bonded, an encapsulant 140 is formed tocover the electronic component 120. In order to form the encapsulant140, for example, a method of stacking a resin film such as ABF, or thelike, in an uncured state on the wiring part 110 and the frame 130 andsubsequently curing the resin film may be used. FIG. 7 illustrates aconfiguration including up to the encapsulant 140 formed. Here, althoughnot shown, after the frame 130 is formed, the support 160 may be removedfrom the wiring part 110. Materials remaining after the support 160 isseparated may be removed appropriately utilizing etching or a desmearmethod used in the art. However, the support 160 may not necessarily beremoved in this stage and may also be removed in a follow-up process.

Thereafter, as illustrated in FIG. 8, a conductive via 132 and aconductive pattern 133 are formed in the frame 130. A hole is formed inthe frame 130 and the encapsulant 140 through laser beam machining ormechanical machining, and filled with a conductive material throughplating, or the like. Thereafter, an external layer such as solderresist is formed to have an appropriate pattern on upper and lowersurfaces thereof, thus obtaining the package structure as illustrated inFIG. 3. Here, as in an exemplary embodiment described hereinafter, theconductive via 132 and the conductive pattern 133 may be obtained inadvance through a method of appropriately processing the frame 130 andpatterning a metal thin film before the frame 130 is bonded to thewiring part 110. Also, an additional electronic component may be stackedand mounted on an upper surface thereof, whereby a so-calledpackage-on-package (POP) structure may be obtained and an additionalencapsulant protecting the additional electronic component may beformed.

FIGS. 9 through 13 are cross-sectional views schematically illustratinga method of manufacturing an electronic component package according toanother exemplary embodiment in the present disclosure.

First, as illustrated in the example of FIG. 9, a wiring part 110 isformed on the support 160, and the uppermost insulating layer 111 isconfigured to expose a portion of the conductive pattern 112.Thereafter, a conductive bump 124 is formed to be connected to theexposed conductive pattern 112. The conductive bump 124 serves to form astable coupling structure with the electronic component 120 and theconductive via 132 of the frame 130. In this case, as described above,an electrical test may be performed on the wiring part 110 before theconductive bump 124 is formed.

Thereafter, as illustrated in the example of FIG. 10, the electroniccomponent 120 is disposed and mounted on the wiring part 110, and theelectrode pad 121 may directly be connected to the conductive bump 124using a process such as a reflow. After the electronic component 120 ismounted, an underfill resin 125, an electrically insulating material,may be provided on the wiring part 110 and on the electronic component120 in order to obtain a more stable mounting structure as illustratedin FIG. 11.

Thereafter, as illustrated in the example of FIG. 12, the frame 130having the through hole is bonded to the wiring part 110 using anadhesive layer 131. In the present exemplary embodiment, the frame 130may be bonded to the wiring part 110 in a state in which the conductivevia 132 and the conductive pattern 133 are formed in advance in theframe 130. In a specific example, a copper clad laminate (CCL) may beused as a basic structure of the frame 130, and the frame 130 may beobtained by performing a process of hole processing on the CCL andfilling the hole with a conductive material, and a process ofappropriately patterning a metal thin film, and the like.

After or when the frame 130 is bonded in the same manner as that of theprevious process, the encapsulant 140 covering the electronic component120 is formed, and thereafter, as in the example illustrated in FIG. 13,an open area is formed in the encapsulant 140 using laser beam machiningor mechanical machining, and accordingly, the conductive pattern 133, orthe like, may be exposed. Thereafter, an external layer such as solderresist, or the like, may be formed to have an appropriate pattern onupper and lower surfaces thereof to obtain a package structure, and inthis case, as described above, the support 160 may be removed at anappropriate time after the frame 130 is bonded.

As set forth above, the use of the electronic component package proposedaccording to exemplary embodiments in the present disclosure may reducea size of a package, and has high utilization even when a plurality ofelectronic components are used. Since an electrical test on a wiringpart of the electronic component package is performed before anelectronic component is mounted, manufacturing efficiency may beconsiderably enhanced. In addition, the aforementioned electroniccomponent package may be effectively manufactured using themanufacturing method according to an exemplary embodiment in the presentdisclosure.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

What is claimed is:
 1. An electronic component package comprising: awiring part including an insulating layer, a conductive pattern formedon the insulating layer, and a conductive via connected to theconductive pattern through the insulating layer; an electronic componentdisposed on the wiring part; a frame disposed on the wiring part andhaving a through hole accommodating the electronic component; anadhesive layer bonding the wiring part and the frame to each other; andan encapsulant filling at least a portion of the through hole.
 2. Theelectronic component package of claim 1, wherein a portion of theadhesive layer is formed between an inner surface of the through holeand the electronic component.
 3. The electronic component package ofclaim 2, wherein the adhesive layer formed between the inner surface ofthe through hole and the electronic component is in contact with theencapsulant.
 4. The electronic component package of claim 1, wherein theadhesive layer is pre-preg.
 5. The electronic component package of claim1, wherein the adhesive layer is a solder resist.
 6. The electroniccomponent package of claim 1, wherein the insulating layer included inthe wiring part includes a photocurable material.
 7. The electroniccomponent package of claim 1, further comprising a conductive viapenetrating through the frame.
 8. The electronic component package ofclaim 7, wherein the encapsulant covers the frame and exposes a regioncorresponding to the conductive via of the frame.
 9. The electroniccomponent package of claim 7, further comprising a conductive patternformed on the encapsulant and electrically connected to the conductivevia of the frame.
 10. The electronic component package of claim 1,further comprising a solder resist formed on the wiring part andexposing an electrode pad connected to the electronic component.
 11. Theelectronic component package of claim 1, further comprising a conductivepattern embedded in the insulating layer and positioned on a surface ofthe wiring part opposing a surface thereof on which the electroniccomponent is disposed.
 12. The electronic component package of claim 1,wherein the electronic component is electrically connected to the wiringpart by a solder.
 13. A method of manufacturing an electronic componentpackage, the method comprising: preparing a wiring part including aninsulating layer, a conductive pattern formed on the insulating layer,and a conductive via connected to the conductive pattern through theinsulating layer; disposing an electronic component on the wiring part;preparing a frame having a through hole and bonding the frame to anupper surface of the wiring part by an adhesive layer; and forming anencapsulant to fill at least a portion of the through hole.
 14. Themethod of claim 13, further comprising: performing an electrical test onthe wiring part by applying an electrical signal to the conductivepattern disposed on the upper surface of the wiring part, prior todisposing the electronic component on the wiring part.
 15. The method ofclaim 14, wherein the preparing of the wiring part includes forming theinsulating layer, the conductive pattern, and the conductive via on asupport, and the electrical test is performed in a state in which thesupport is coupled to the wiring part.
 16. The method of claim 13,wherein in a region of the through hole, the adhesive layer is incontact with the encapsulant.
 17. The method of claim 13, wherein theframe is bonded to the wiring part after the electronic component isdisposed on the wiring part.
 18. The method of claim 13, furthercomprising forming a conductive via penetrating through the frame,before bonding the frame to the upper surface of the wiring part. 19.The method of claim 13, further comprising forming a conductive viapenetrating through the frame, after bonding the frame to the uppersurface of the wiring part.
 20. An electronic component packagecomprising: a wiring part including an insulating layer, a conductivepattern formed on the insulating layer, and a conductive via connectedto the conductive pattern through the insulating layer; an electroniccomponent disposed on the wiring part and having an electrode padelectrically connected to the conductive pattern through a conductivestructure disposed therebetween; a frame disposed on the wiring part andhaving a through hole accommodating the electronic component; anadhesive layer bonding the wiring part and the frame to each other; andan encapsulant filling at least a portion of the through hole, wherein amelting temperature of the conductive structure is lower than that ofthe conductive pattern of the wiring part and the electrode pad of theelectronic component.
 21. The electronic component package of claim 20,wherein the encapsulant and the adhesive layer contact each other in aregion of the through hole.
 22. The electronic component package ofclaim 20, further comprising a conductive via penetrating through theframe and electrically connected to the conductive pattern of the wiringpart.
 23. The electronic component package of claim 22, wherein theencapsulant covers the frame and exposes a region corresponding to theconductive via of the frame.
 24. The electronic component package ofclaim 20, further comprising a solder resist between the electroniccomponent and the wiring part.
 25. The electronic component package ofclaim 20, further comprising an underfill resin between the electroniccomponent and the wiring part.